OnBoard Series

COB technology omits the SMD light emitting tube packaging process, color separation, braiding, patch and other technological processes, shortens the process path, and reduces the solder joints of LED (because the LED small spacing products packaged by SMD need SMT on PCB, calculated by P1.2mm, SMD small spacing products have more than 2 million more welding joints than COB products). This improves the reliability of the high resolution COB LED panels of almost 10 to 1.