How TSMC Keeps Getting Better
020622 Like and subscribe. This is an archive, check the link in the end if you are owner. In 2021, TSMC fabbed about 12 to 13 million 300-millimeter wafers. Assuming each die is about 100 square millimeters large, that is about 8 billion chips. Eight billion.
Semiconductor manufacturing is the most sophisticated, unforgiving high volume production technology that has ever been done successfully. You need a lot of practice. The more chips that TSMC makes, the better it gets at it.
In this video, I want to talk about how a fab like TSMC improves their operations. How they think about yield, speed up throughput, and in general get better at wafer fabrication.
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