MGChemicals

A heartwarming gathering at MG! Our Christmas Potluck was filled with smiles, delicious food and great company🥳 It’s these moments that bring us closer as a team! Wishing everyone a joyful holiday season❤️ #christmas #potluck #potlucktrend #companyevent #teambuilding

Barbie challenge but its Christmas version instead!😍 What products of ours did you spot in this video? #chemical #chemicalmanufacturing #adhesives #pottingcompound #freezespray #esdsafe #christmas #barbiechallenge #barbie

8617A silicone-free thermal grease is a heat sink grease with very high thermal conductivity and exceptional wetting properties. The thixotropic consistency helps ensure the paste conforms to the intricate geometry at the component/heatsink interface while avoiding bleed and pump out common with other pastes. 8617A has a wide operating temperature range, making it a practical solution where high heat dissipation and thermal cycling stability are needed. Once applied, circuits can be powered up immediately offering exceptional convenience. This thermal paste is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like thermal sensors, IGBTs, thermal wells and power resistors. The paste’s soft consistency allows easy compression to achieve thin bond lines, minimizing thermal resistance. For more information, please visit: www.mgchemicals.com

Bet you didn’t know we can get down like that too😉 Who do you think has the best move? Meet the team behind the products you use daily!🥳🥳 Products used in this video include: - 419E Conformal Coating - 402E Super Duster - 8241-T Wipes #superduster #conformalcoating #coating #alcoholwipes #wipes #chemicalproducts #electronics #chemicalmanufacturing #chemist #chemistry #electrical #engineering #fun #j4f #humour #officehumour

8327GL6 is a 1-part, silicone-free, paste-type gel with extreme thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. It has a very low modulus and robust temperature range, making it a practical solution where high heat dissipation, low component stress and thermal cycling stability are needed. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience. This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs. This product’s consistency is flowable enough to dispense from a syringe yet will not run making it a truly form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines under 25 microns, minimizing thermal resistance. For more information visit: www.mgchemicals.com

8327GL5 is a 1-part, silicone-free, high temperature, soft gel with very high thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. It has a very low modulus and robust temperature range, making it a practical solution where high heat dissipation, low component stress and thermal cycling stability are needed. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience. This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs. This product’s consistency is flowable enough to dispense from a syringe yet will not run making it a truly form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines, minimizing thermal resistance. For more information visit: www.mgchemicals.com

8327GL3 is a 1-part silicone-free, ultra soft gel with high thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience. This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs. This product is flowable enough to dispense from a syringe and will not run making it a form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines, minimizing thermal resistance. For more info: www.mgchemicals.com

Our 842AR-PS is made out of real silver! The cured traces are durable, corrosion resistance and highly conductive🔬 Get yours today!! #silverpen #silver #pen #chemicalmanufacturing #chemicalproduct #chemicalgoods #conductivepen #diyprojects #hobbyist

8327GL6 is a 1-part, silicone-free, paste-type gel with extreme thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. It has a very low modulus and robust temperature range, making it a practical solution where high heat dissipation, low component stress and thermal cycling stability are needed. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience. This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs. This product’s consistency is flowable enough to dispense from a syringe yet will not run making it a truly form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines under 25 microns, minimizing thermal resistance. For more information visit: www.mgchemicals.com

8327GL5 is a 1-part, silicone-free, high temperature, soft gel with very high thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. It has a very low modulus and robust temperature range, making it a practical solution where high heat dissipation, low component stress and thermal cycling stability are needed. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience. This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs. This product’s consistency is flowable enough to dispense from a syringe yet will not run making it a truly form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines, minimizing thermal resistance. For more information visit: www.mgchemicals.com

8327GL3 is a 1-part silicone-free, ultra soft gel with high thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience. This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs. This product is flowable enough to dispense from a syringe and will not run making it a form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines, minimizing thermal resistance. For more info: www.mgchemicals.com

Its just as simple as that! With our wide range of products, we try our best to break it down and make it as easy as possible for your to work with and navigate them all!😎 Our infamous potting conpounds names may look so similar at first, but always pay attention to these little cues we give you🥳🥳 #epoxy #pottingconpound #epoxysystem #resin #mgchemicals #lab #breakdown #chemicals

Whats orange insulatice coating again?🤔Think of it as your trusty shield, defending against arc and short circuits, guiding electricity like a GPS. That eye-catching orange? It's like a warning sign for high voltage, keeping you safe. Plus, it's flexible, so it's like your favorite tool that adapts to any job. Say goodbye to the ordinary coatings; this one gets you and your electrical needs. ⚙️ #ElectricalEngineering #highvalueman #electrician #orangcoating #insulativecoating #chemicalsolutions #aestheticvideos #fun

How relatable is this😎? We try to keep our lab clean (most of the time) and when it’s not, we have A TON of products that are suitable for cleaning electronics👏🏼 Check out our wide range of products now on mgchemicals.com!!! #mgchemicals #chemicalsolutions #cleaningsolutions #cleaning #superduster #relatable #chemicals #electronicscleaning #lab #thelab #chemist #chemicalengineers #chemicalengineering #funny

402E is an eco-friendly, cordless rechargeable alternative to conventional canned compressed air dusters. Unlike dusters using canned air, the air force remains consistent and its surface does not get cold during extended use. This e-duster has L1, L2, H,1 and H2 speed modes to balance performance and battery life. 402E is ideal for use around the home and once for cleaning dust, lint and debris on keyboards, audio visual and lab equipment. Perfect for repair and maintenance technician s and service providers.

https://mgchemicals.com/products/soldering-supplies/soldering-flux/soldering-flux-paste/ 8341 is a no-clean soldering flux paste. It is designed for lead-free alloys, but also works well with conventional leaded solders. This tacky no-clean flux paste uses a mix of rosin, thickener, and high-grade synthetically refined resin. The flux provides fast and widespread wetting during soldering and leaves non-conductive and non-tacky residues. This solder flux paste is ideal for solder touch-ups, repairs, or reworks of surface mount assemblies. Try 8342 for a rosin-based flux paste. For a liquid flux try 835 (rosin-based), 8351 (no-clean halogen-free), 836LFNC (no-clean lead-free), or 837LFWS, (lead-free water-soluble). Features & Benefits Soldering flux paste for electronics Excellent wettability Clear, non-conductive, and non-tacky residues Usable for both lead-free and leaded alloys Meets J-STD-004B ROL1 classification RoHS-compliant

Do you know why its so important to replace thermal paste? Fresh thermal paste is a game-changer for optimal performance! At MG, our Thermal Interface Materials are diverse, suitable for all of your requirements, ranging from adhesives to pastes, to gap fillers, thermal gels and more!🎉❄️ #thermalpaste #thermalinterfacematerial #adhesives #pastes #gapfillers #fillers #gels #thermalgels #heatsink #cpu #pcbs #epoxy #tim #bonds

https://mgchemicals.com/products/electronics-maintenance/air-dusters/electric-air-duster/ 402E is a portable, hand-held, eco-friendly electronic blower that’s an alternative to using compressed air for removing dust in hard-to-reach areas. This duster has multiple settings, balancing performance with battery life and unlike compressed air products, does not get cold during extended use. It is ideal for use around the home and office for cleaning dust, lint and debris on keyboards, audio visual, PCBs, telecommunication devices and lab equipment. It is also an excellent choice for repair and maintenance technicians and service providers. To ensure optimal performance and extend the lifespan of the 402E Electric SUPER DUSTER™, recharge the battery at 30% capacity and let the motor cool for 5-10 minutes before charging. Features & Benefits ESD-safe Eco-friendly and cost-effective Cordless and rechargeable USB charging cable included—fast recharge Strong dust blowing Digital display 5 h of use (low) and 40 min of use (high) RoHS compliant

https://mgchemicals.com/products/thermal-interface-materials/liquid-thermal-gels/thermal-gel/ 8327GL3 is a 1-part silicone-free, ultra soft gel with high thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience. This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs. This product is flowable enough to dispense from a syringe and will not run making it a form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines, minimizing thermal resistance. For higher thermal conductivity, use 8327GL5 and 8327GL6 which have thermal conductivities of 5 and 6 W/(m·K) respectively. We also have a full line of thermally conductive adhesives which provide a permanent bond and offer exceptional shock protection. Features & Benefits Thermal conductivity of 3.5 W/(mK) Flame retardant—meets UL94 V-0 1-part, non-curable, dispensable gel Silicone-free, will not contaminate surfaces Low modulus, ideal for aggressive thermal cycling conditions

https://mgchemicals.com/products/thermal-interface-materials/liquid-thermal-gels/thermal-interface-gel/ 8327GL5 is a 1-part, silicone-free, high temperature, soft gel with very high thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. It has a very low modulus and robust temperature range, making it a practical solution where high heat dissipation, low component stress and thermal cycling stability are needed. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience. This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs. This product’s consistency is flowable enough to dispense from a syringe yet will not run making it a truly form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines, minimizing thermal resistance. For applications demanding less thermal conductivity, use 8327GL3 whereas 8327GL6 is suited for applications requiring maximum heat dissipation. We also have a full line of thermally conductive adhesives which provide a permanent bond and offer exceptional shock protection. Features & Benefits Thermal conductivity of 5.1 W/(m·K) Flame retardant—meets UL94 V-0 High temperature stability 1-part, non-curable, dispensable gel Zero pump out—no slump under low pressure Silicone-free, will not contaminate surfaces Low modulus, ideal for aggressive thermal cycling conditions

https://mgchemicals.com/products/thermal-interface-materials/liquid-thermal-gels/thermal-conductive-gel/ 8327GL6 is a 1-part, silicone-free, paste-type gel with extreme thermal conductivity and flame retardancy. This form-in-place, non-curable gel is easy to dispense and conforms to the intricate geometries at the component/heatsink interface, ensuring all air is displaced and eliminating potential hotspots. It has a very low modulus and robust temperature range, making it a practical solution where high heat dissipation, low component stress and thermal cycling stability are needed. Since the gel does not cure, circuits can be powered up immediately following application, offering exceptional convenience. This thermal gel is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like telecommunications equipment, PCs for gamers and electric vehicle battery packs. This product’s consistency is flowable enough to dispense from a syringe yet will not run making it a truly form-in-place material. The low modulus gel can easily be compressed to achieve thin bond lines under 25 microns, minimizing thermal resistance. For applications demanding less thermal conductivity, we have the 8327GL3 and 8327GL5 with thermal conductivities of 3.5 and 5.1 W/(m·K) respectively. We also have a full line of thermally conductive adhesives which provide a permanent bond and offer exceptional shock protection. Features & Benefits Thermal conductivity of 6 W/(m·K) Flame retardant – meets UL94 V-0 1-part, non-curable, dispensable gel Zero pump out—no slump under low pressure Silicone-free, will not contaminate surfaces Low modulus, ideal for aggressive thermal cycling conditions

https://mgchemicals.com/products/grease-for-electronics/thermal-paste/heat-sink-compound/ 8617A silicone-free thermal grease is a heat sink grease with very high thermal conductivity and exceptional wetting properties. The thixotropic consistency helps ensure the paste conforms to the intricate geometry at the component/heatsink interface while avoiding bleed and pump out common with other pastes. 8617A has a wide operating temperature range, making it a practical solution where high heat dissipation and thermal cycling stability are needed. Once applied, circuits can be powered up immediately offering exceptional convenience. This thermal paste is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like thermal sensors, IGBTs, thermal wells and power resistors. The paste’s soft consistency allows easy compression to achieve thin bond lines, minimizing thermal resistance. For applications demanding higher thermal conductivity, we have the 8618 whereas our 8616 and 860 is suited for applications requiring less heat dissipation. We also have a full line of thermally conductive adhesives which provide a permanent bond and thermal gels which offer tack adhesion where a low modulus material is needed. Features & Benefits Thermal conductivity of 3 W/(m·K) 1-component compound Silicone-free, will not contaminate surfaces Wide operating temperature, ideal for aggressive thermal cycling conditions Low bond line thickness

Check out our 8327GL series that come with up to 3 different levels of thermal conductivity👏🏻👏🏻 #thermalgrease #premiumgrease #chemicalsolutions #chemicalproducts #engineering #cleantok #viral #ecofriendly

https://mgchemicals.com/products/grease-for-electronics/thermal-paste/heat-sink-compound/ 8617A silicone-free thermal grease is a heat sink grease with very high thermal conductivity and exceptional wetting properties. The thixotropic consistency helps ensure the paste conforms to the intricate geometry at the component/heatsink interface while avoiding bleed and pump out common with other pastes. 8617A has a wide operating temperature range, making it a practical solution where high heat dissipation and thermal cycling stability are needed. Once applied, circuits can be powered up immediately offering exceptional convenience. This thermal paste is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like thermal sensors, IGBTs, thermal wells and power resistors. The paste’s soft consistency allows easy compression to achieve thin bond lines, minimizing thermal resistance. For applications demanding higher thermal conductivity, we have the 8618 whereas our 8616 and 860 is suited for applications requiring less heat dissipation. We also have a full line of thermally conductive adhesives which provide a permanent bond and thermal gels which offer tack adhesion where a low modulus material is needed. Features & Benefits Thermal conductivity of 3 W/(m·K) 1-component compound Silicone-free, will not contaminate surfaces Wide operating temperature, ideal for aggressive thermal cycling conditions Low bond line thickness

https://mgchemicals.com/products/grease-for-electronics/thermal-paste/heat-sink-grease/ 8618 silicone-free thermal grease is a heat sink paste with very high thermal conductivity and exceptional wetting properties. The thixotropic consistency helps ensure the paste conforms to the intricate geometry at the component/heatsink interface while avoiding bleed and pump out common with other pastes. 8618 has a wide operating temperature range, making it a practical solution where high heat dissipation and thermal cycling stability are needed. Once applied, circuits can be powered up immediately offering exceptional convenience. This thermal paste is most often used as a gap filler on heatsinks to CPUs, LEDs, and other electronic components. Its high thermal conductivity makes it ideal for energy-intensive devices like thermal sensors, IGBTs, thermal wells and power resistors. The paste’s soft consistency allows easy compression to achieve thin bond lines, minimizing thermal resistance. For applications demanding lower thermal conductivity, we have the 8617A, 8616 and 860. We also have a full line of thermally conductive adhesives which provide a permanent bond and thermal gels which offer tack adhesion where a low modulus material is needed. Features & Benefits Thermal conductivity of 6 W/(m·K) 1-component compound Silicone-free, will not contaminate surfaces Wide operating temperature, ideal for aggressive thermal cycling conditions Low bond line thickness